The wire connections were successfully used as electronic packaging technology in 1970s–1980s. But this type of packaging has two weak points. First, for the wire connections, the metallized pads inside a package are necessary. They take the large area. Second, to avoid possible failures caused by parasitic induced signals in wires it is necessary to eliminate the relationship between the device and the substrate, which reduces the load on the semiconductor chip. So the traditional package design such as wire connection was substituted for the flip-chip soldered connection. It should be taken into account that in flip-chip packages it is necessary to use materials with a low coefficient of thermal expansion (CTE) in order to minimize the stress that occurs due to the CTE mismatch between the device, the substrate and the connecting material. These problems led to the development of embedded packages without interconnects. In the embedded construction the conditions of the heat flow from the active device were improved.
Author(s) Details:
Konstantin O. Petrosyants,
National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Moscow, Russia and Institute for Design Problems in Microelectronics, Russian Academy of Sciences, Moscow, Russia.
Nikita I. Ryabov,
National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Moscow, Russia.
